BGA IR stanica INFRA 2001A

YIHUA 1000A infrared soldering station

 

Feature

 

1. Using the newSAMSUNG microcomputer processor PIDprogrammable temperature control technology and uses an infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.

2. Adoptinfrared weld technologywhich independent exploration, infrared penetration strength, components uniform heating, beyond the traditional hot air heating vowed to prevent blow off the IC surrounding small components.

3.Technician focused infrared heatis easy to target most component removal/replacement and re-work.

4. Infrared heat source bulbs arelong-lived, un-expensive and easily replaced.

5. Has bright delicate,low voltage LED lighting, safety and energy conservation.

6.It hasExternal Sensor Temperature control mode, that is detected by the sensor IC surface temperature control temperature,this function is good for freshman operation ,it’s safe way protectcomponents .

7.MountTechnology (SMT) components 15-35cm in size.

8. This machine has 540W heating system , widely to 120mm*120mm.

9.Preheating plate color is black,from the photics point of view, black coloreasy to absorb heating, shorten the warm-up time.

10. Powerful human function design, with the following functions:

A.Temperature correction function Correction of temperature range:-50°C~+50 °C(Infrared lamp analog value 580).

B.Celsius / Fahrenheit temperature display function

11. This machine also hassoldering iron function, if you have the device ,you can used for all of the components solder ,desoldering ,preheating ,repair all components ,especially Micro BGA components.

 

 

Technical data

 

Voltage AC220V±10%

Maxpowerconsumption 715W

 

Preheating station parts

 

Maxpowerconsumption 540W

Light-emittingcomponents Farinfraredheatingplate

TemperatureRange 50°C-300°C/122°F~572°F or 50 °C ~200 °C / 122°F~488°F

DisplayType LED

Preheatingarea 120*120mm

 

Infraredlamppart

 

Maxpowerconsumption 150W

Light-emittingcomponents Infraredemissionlamp

TemperatureRange 100°C-350°C/212°F~662°F

TemperatureStability ±1°C

DisplayType LED

Effectiveirradiationarea 35*35mm

Come with 2 lens cup, you can be choice two of lens cup from 28mm / 38mm /48mm.

 

Solderingstationpart

 

Maxpowerconsumption 75W

Heatingcomponentsimportedheater

TemperatureRange 200°C-480°C/392°F~896°F

TemperatureStability ±1°C(statics)

Tipofgroundvoltage <2mV

Tipgroundimpedance<2ohm

DisplayType LEDDisplay

Handlecablelength ≥100cm

 

 

YIHUA 1000A Infrared BGA rework stationdisplay

 

 

 

 

 

Operation infraredBGA rework stationNOTICE

 

1.Repair circuit boards required precautions and necessary protective measures

1)To ensure that both sides of the circuit board preheat zone without fusible explosive flammable components,like Plastic,Display,Phone camera,LED,Electrolytic capacitors.

2)Ensure that no combustible fusible explosive components in Infrared light can shine on the area, If you can not avoid,Must use reflective paper keep out that. like Plastic,Display,Phone camera,LED,Electrolytic capacitors.

2.According to IC size, use a suitable diameter lamp cup(lamp cup size larger than IC size);Install lights Cup minimize the distance between lamp and IC,to facilitates heating.

3. Ensure that the working environment is no greater airflow to prevent heat loss,well sheltered measures when necessary.

4. Apply solder paste to the IC before the de-soldering,also you can early preheat then Apply solder paste,Especially BGA package IC,should be early preheat then apply solder paste,the can make solder paste penetrate into the bottom of the IC.

5.Wear heat protective gloves and goggles. Place the visor, good shading measures to protect the eyes.

6. Turn on the Infrared light power,set the temperature to about 280°C.Make the appropriate adjustments based on the size of the IC and circuit board. IC by infrared light irradiation will be rapidly warming (generally 1 to 3 minutes) .

7. Just started using this product, it is best to try to use the abandoned circuit board rework a few times. and so familiar with the use of this product ,then carry out normal maintenance work.

 

Usage

 

1).Suitableforde-solderingandsolderingBGA,SOIC,CHIP,QFP,PLCCpackageSMDIC,

ParticularlysuitablefordesolderingBGAmodule,computermotherboardnorthandsouthbridge,

allkindsofmobilephonemotherboard SMTICandLEDlights.

2).Shrinking,Paintdrying,adhesiveremoval,thawing,warming,Plasticweldingetc.

Hmotnosť produktu:13 kg